EPS150FA Overview

Visualize Success by Analyzing Sub-Micron Failure

Electrical failure verification, localization and debug with the ability to probe features smaller than 1 μm. Flexibility to adapt from wafer-to-chip-to-package investigation in a matter of seconds, minimizing time-to-data and ultimately delivering faster time to market.

Applications: Failure Analysis

EPS150FA Key Features

High Magnification Optics

• Stable microscope bridge design and XY microscope
• Up to 4000x magnification (option)
• Laser cut and camera ready
• Easy navigation and high quality image
• Contact submicron features
• Easy upgrade

Flexible Design

• Probe card simultaneously used with single needles (option)
• Movable platen enables single DUT holder
• Chuck ready for single DUT
• Flexible and fast setup change
• Quickest transition from wafer-to-chip-to-package
• Versatile upgrade paths

Vacuum Positioner

• 200 TPI with <1 μm accuracy
• DPP450 positioner with nanometer resolution and accuracy (option)
• Backlash free
• High positioning accuracy comparable to semi-automated systems
• Fast and precise positioning
• Probe smallest DUTs without damage